Product Type Features Category Wire to Board
Assembly Type Wafer
Pitch (mm) 2.00mm
Product Series A2009 Series
Configuration Features Number of Rows 2
Number of Positions 2x2P~2x20P
Electrical characteristics Operating Voltage (V AC/DC) 250
Current(Max)(A) 2
Contact Resistance 30mΩMax
Insulation Resistance 1000MΩMin
Shell characteristics Housing Material Nylon 66,UL94V-0
Color Black
PIN Material Brass
PIN Plating Tin over Nickel
Use the environment Operating Temperature Range (°C) -40℃~105℃
Industry Standard UL/CUL E326732
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